| 000 -LEADER |
|---|
| fixed length control field |
03628nam a22004575i 4500 |
| 003 - CONTROL NUMBER IDENTIFIER |
|---|
| control field |
OSt |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20140310143330.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
|---|
| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
110512s2011 xxk| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9780857292360 |
|
978-0-85729-236-0 |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.381 |
| Edition number |
23 |
| 264 #1 - |
|---|
| -- |
London : |
| -- |
Springer London, |
| -- |
2011. |
| 912 ## - |
|---|
| -- |
ZDB-2-ENG |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Grossmann, Günter. |
| Relator term |
editor. |
| 245 14 - IMMEDIATE SOURCE OF ACQUISITION NOTE |
|---|
| Title |
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects |
| Medium |
[electronic resource] / |
| Statement of responsibility, etc |
edited by Günter Grossmann, Christian Zardini. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
VIII, 313 p. 202 illus., 22 illus. in color. |
| Other physical details |
online resource. |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
1. Deformation and Fatigue of Solders -- 2. Factors Affecting the Bulk Embrittlement of Pb-Free Solder Joints -- 3. Thermal Fatigue Analysis -- 4. Electrochemical Behavior of Solder Alloys -- 5. Void Formation by Kirkendall Effect in Solder Joints -- 6. Tin Whiskers -- 7. Electromigration in Solder Interconnects -- 8. Impact of Black Pad and Intermetallic Layers on the Risk for Fractures in Solder Joints to Electroless Nickel/Immersion Gold -- 9. Reliability of Electronic Assemblies under Mechanical Shock Loading -- 10. Impact of Humidity and Contamination on Surface Insulation Resistance and Electrochemical Migration -- 11. Lead Free and Other Process Effects on Conductive Anodic Filamentation (CAF) Resistance of Glass Reinforced Epoxy Laminates -- 12. PCB Delamination -- 13. Excessive Warpage of Large Packages during Reflow Soldering -- 14. Popcorn Cracking -- 15. Thermal Capability of Components. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc |
The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Engineering. |
|
|---|
| Topical term or geographic name as entry element |
System safety. |
|
|---|
| Topical term or geographic name as entry element |
Electronics. |
|
|---|
| Topical term or geographic name as entry element |
Optical materials. |
|
|---|
| Topical term or geographic name as entry element |
Surfaces (Physics). |
|
|---|
| Topical term or geographic name as entry element |
Engineering. |
|
|---|
| Topical term or geographic name as entry element |
Electronics and Microelectronics, Instrumentation. |
|
|---|
| Topical term or geographic name as entry element |
Optical and Electronic Materials. |
|
|---|
| Topical term or geographic name as entry element |
Quality Control, Reliability, Safety and Risk. |
|
|---|
| Topical term or geographic name as entry element |
Characterization and Evaluation of Materials. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Zardini, Christian. |
| Relator term |
editor. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
|---|
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Display text |
Printed edition: |
| International Standard Book Number |
9780857292353 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
http://dx.doi.org/10.1007/978-0-85729-236-0 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
|
| Item type |
E-Book |
