000 -LEADER |
fixed length control field |
03147nam a22005055i 4500 |
003 - CONTROL NUMBER IDENTIFIER |
control field |
OSt |
005 - DATE AND TIME OF LATEST TRANSACTION |
control field |
20140310143332.0 |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
fixed length control field |
cr nn 008mamaa |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
fixed length control field |
110204s2011 xxu| s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
International Standard Book Number |
9781441957603 |
|
978-1-4419-5760-3 |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
Classification number |
621.381 |
Edition number |
23 |
264 #1 - |
-- |
New York, NY : |
-- |
Springer New York, |
-- |
2011. |
912 ## - |
-- |
ZDB-2-ENG |
100 1# - MAIN ENTRY--PERSONAL NAME |
Personal name |
Liu, Johan. |
Relator term |
author. |
245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE |
Title |
Reliability of Microtechnology |
Medium |
[electronic resource] : |
Remainder of title |
Interconnects, Devices and Systems / |
Statement of responsibility, etc |
by Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson. |
250 ## - EDITION STATEMENT |
Edition statement |
1. |
300 ## - PHYSICAL DESCRIPTION |
Extent |
XIII, 204p. 50 illus. |
Other physical details |
online resource. |
505 0# - FORMATTED CONTENTS NOTE |
Formatted contents note |
Introduction to Reliability and its Importance -- Reliability Metrology -- General Failure Mechanisms of Microsystems -- Solder and Conductive Adhesive Joint Reliability -- Accelerated Testing -- Reliability Design for Manufacturability -- Component Reliability -- System Level Reliability -- Reliability and Quality Management of Microsystem -- Experimental Tools for Reliability Analysis. |
520 ## - SUMMARY, ETC. |
Summary, etc |
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also: Discusses the general failure mechanisms of microsystems on a component level Offers comprehensive coverage of solder joint reliability at the microsystems level Analyzes�quality issues and manufacturing at the microsystems level Reliability of Microtechnology is an ideal volume for researchers and professional engineers working in reliability and manufacturing. The book also includes exercises and detailed solutions at the end of each chapter. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Engineering. |
|
Topical term or geographic name as entry element |
System safety. |
|
Topical term or geographic name as entry element |
Electronics. |
|
Topical term or geographic name as entry element |
Optical materials. |
|
Topical term or geographic name as entry element |
Engineering. |
|
Topical term or geographic name as entry element |
Electronics and Microelectronics, Instrumentation. |
|
Topical term or geographic name as entry element |
Optical and Electronic Materials. |
|
Topical term or geographic name as entry element |
Quality Control, Reliability, Safety and Risk. |
|
Topical term or geographic name as entry element |
Nanotechnology and Microengineering. |
700 1# - ADDED ENTRY--PERSONAL NAME |
Personal name |
Salmela, Olli. |
Relator term |
author. |
|
Personal name |
Sarkka, Jussi. |
Relator term |
author. |
|
Personal name |
Morris, James E. |
Relator term |
author. |
|
Personal name |
Tegehall, Per-Erik. |
Relator term |
author. |
|
Personal name |
Andersson, Cristina. |
Relator term |
author. |
710 2# - ADDED ENTRY--CORPORATE NAME |
Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY |
Title |
Springer eBooks |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Display text |
Printed edition: |
International Standard Book Number |
9781441957597 |
856 40 - ELECTRONIC LOCATION AND ACCESS |
Uniform Resource Identifier |
http://dx.doi.org/10.1007/978-1-4419-5760-3 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) |
Source of classification or shelving scheme |
|
Item type |
E-Book |