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Silicon Carbide Microsystems for Harsh Environments (Record no. 10236)

000 -LEADER
fixed length control field 03385nam a22004335i 4500
003 - CONTROL NUMBER IDENTIFIER
control field OSt
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20140310143332.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 110516s2011 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781441971210
978-1-4419-7121-0
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.381
Edition number 23
264 #1 -
-- New York, NY :
-- Springer New York,
-- 2011.
912 ## -
-- ZDB-2-ENG
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Wijesundara, Muthu B.J.
Relator term author.
245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE
Title Silicon Carbide Microsystems for Harsh Environments
Medium [electronic resource] /
Statement of responsibility, etc by Muthu B.J. Wijesundara, Robert Azevedo.
300 ## - PHYSICAL DESCRIPTION
Extent XVI, 232 p.
Other physical details online resource.
440 1# - SERIES STATEMENT/ADDED ENTRY--TITLE
Title MEMS Reference Shelf,
International Standard Serial Number 1936-4407 ;
Volume number/sequential designation 22
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Introduction to Harsh MEMs -- Silicon Carbide Processing -- Silicon Carbide Electronics -- Silicon Carbide MEMS Devices -- Silicon Carbide MEMs Device Packaging -- System Integration.
520 ## - SUMMARY, ETC.
Summary, etc

Silicon Carbide Microsystems for Harsh Environments reviews state-of-the-art Silicon Carbide (SiC) technologies that, when combined, create microsystems capable of surviving in harsh environments. Technological readiness of the system components, key issues when integrating these components into systems, and other hurdles in harsh environment operation are discussed at length. The authors use the SiC technology platform suite as the model platform for developing harsh environment Microsystems, and then detail the current status of the specific individual technologies (electronics, MEMS, packaging). Additionally, methods towards system level integration of components and key challenges are evaluated and discussed based on the current state of SiC materials processing and device technology. Issues such as temperature mismatch, process compatibility and temperature stability of individual components and how these issues manifest when building the system receive thorough investigation. This book also:

       
  • Addresses the SiC platform for complete microsystems and goes beyond the individual device level
    •    
  • Provides a comprehensive collection of SiC technologies information relevant to harsh environment microsystems
    •    
  • Covers the challenges in combining SiC process and components to a microsystem
    •    
  • Discusses power source and signal transmission issues in the context of the harsh environment application space

Silicon Carbide Microsystems for Harsh Environments not only reviews the state-of-the-art MEMS devices, but also provides a framework for the joining of electronics and MEMS along with packaging into usable harsh-environment-ready sensor modules.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
Topical term or geographic name as entry element Electronics.
Topical term or geographic name as entry element Systems engineering.
Topical term or geographic name as entry element Engineering.
Topical term or geographic name as entry element Electronics and Microelectronics, Instrumentation.
Topical term or geographic name as entry element Circuits and Systems.
Topical term or geographic name as entry element Nanotechnology and Microengineering.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Azevedo, Robert.
Relator term author.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9781441971203
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/978-1-4419-7121-0
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme
Item type E-Book
Copies
Price effective from Permanent location Date last seen Not for loan Date acquired Source of classification or shelving scheme Koha item type Damaged status Lost status Withdrawn status Current location Full call number
2014-03-28AUM Main Library2014-03-28 2014-03-28 E-Book   AUM Main Library621.381