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02559nam a22003975i 4500 |
| 003 - CONTROL NUMBER IDENTIFIER |
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| control field |
OSt |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
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| control field |
20140310143332.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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| fixed length control field |
cr nn 008mamaa |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
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| fixed length control field |
101118s2011 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9781441972767 |
|
978-1-4419-7276-7 |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.3815 |
| Edition number |
23 |
| 264 #1 - |
|---|
| -- |
New York, NY : |
| -- |
Springer New York : |
| -- |
Imprint: Springer, |
| -- |
2011. |
| 912 ## - |
|---|
| -- |
ZDB-2-ENG |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Burghartz, Joachim. |
| Relator term |
editor. |
| 245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE |
|---|
| Title |
Ultra-thin Chip Technology and Applications |
| Medium |
[electronic resource] / |
| Statement of responsibility, etc |
edited by Joachim Burghartz. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
XXII, 467p. 252 illus., 157 illus. in color. |
| Other physical details |
online resource. |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Fabrication technologies for ultra-thin chips -- Post-processing techniques and issues -- Properties of ultra-thin chips; Applications. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc |
Ultra-thin Chip Technology and Applications edited by: Joachim N. Burghartz Ultra-thin chip technology has the potential to provide solutions for overcoming bottlenecks in silicon technology and for leading to new applications. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, assembly, characterization, modeling and applications of ultra-thin chips. •Provides a comprehensive overview of the challenges in ultra-thin chip fabrication, post processing, properties and applications by leaders in the field sharing their newest results and ideas; •Compares strengths and weaknesses of three generic fabrication processes for ultra-thin chips; •Describes electronic, mechanical, optical, and thermal properties of ultra-thin chips that are different from those of conventional, thick chips; •Shows that thin chip technology and its applications represents a new paradigm in silicon technology. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Engineering. |
|
|---|
| Topical term or geographic name as entry element |
Computer aided design. |
|
|---|
| Topical term or geographic name as entry element |
Systems engineering. |
|
|---|
| Topical term or geographic name as entry element |
Engineering. |
|
|---|
| Topical term or geographic name as entry element |
Circuits and Systems. |
|
|---|
| Topical term or geographic name as entry element |
Computer-Aided Engineering (CAD, CAE) and Design. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
|---|
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Display text |
Printed edition: |
| International Standard Book Number |
9781441972750 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
http://dx.doi.org/10.1007/978-1-4419-7276-7 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
|
| Item type |
E-Book |
