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003 - CONTROL NUMBER IDENTIFIER |
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005 - DATE AND TIME OF LATEST TRANSACTION |
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20140310143336.0 |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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110520s2011 xxu| s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
International Standard Book Number |
9781461402107 |
|
978-1-4614-0210-7 |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
Classification number |
620.5 |
Edition number |
23 |
264 #1 - |
-- |
New York, NY : |
-- |
Springer New York : |
-- |
Imprint: Springer, |
-- |
2011. |
912 ## - |
-- |
ZDB-2-ENG |
100 1# - MAIN ENTRY--PERSONAL NAME |
Personal name |
Proulx, Tom. |
Relator term |
editor. |
245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE |
Title |
MEMS and Nanotechnology, Volume 4 |
Medium |
[electronic resource] : |
Remainder of title |
Proceedings of the 2011 Annual Conference on Experimental and Applied Mechanics / |
Statement of responsibility, etc |
edited by Tom Proulx. |
300 ## - PHYSICAL DESCRIPTION |
Extent |
VIII, 192 p. |
Other physical details |
online resource. |
440 1# - SERIES STATEMENT/ADDED ENTRY--TITLE |
Title |
Conference Proceedings of the Society for Experimental Mechanics Series, |
International Standard Serial Number |
2191-5644 |
505 0# - FORMATTED CONTENTS NOTE |
Formatted contents note |
Integrated Process Feasibility of Hard-mask for Tight Pitch Interconnects Fabrication -- Thermoelectric Effects in Current Induced Crystallization of Silicon Microstructures -- Evaluation of Resistance Measurement Techniques in Carbon Black and Carbon -- Nano-tubes Reinforced Epoxy -- A Nano-tensile Tester for Creep Studies -- The Measurement of Cyclic Creep Behavior in Copper Thin Film Using Microtensile Testing -- New Insight Into Pile-Up in Thin Film Indentation -- Measuring Substrate-independent Young’s Modulus of Thin Films -- Analysis of Spherical Indentation of an Elastic Bilayer Using a Modified Perturbation Approach -- Nano-indentation Studies of Polyglactin 910 Monofilament Sutures -- Analytical Approach for the Determination of Nanomechanical Properties for Metals -- Advances in Thin Film Indentation -- Cyclic Nanoindentation Shakedown of Muscovite and its Elastic Modulus Measurement -- Assessment of Digital Holography for 3D-shape Measurement of Micro Deep Drawing Parts in Comparison to Confocal Microscopy -- Full-field Bulge Testing Using Global Digital Image Correlation -- Experimental Investigation of Deformation Mechanisms Present in Ultrafine-grained Metals -- Characterization of a Variation on AFIT's Tunable MEMS Cantilever Array Metamaterial -- MEMS for Real-time Infrared Imaging -- New Insights Into Enhancing Microcantilever MEMS Sensors -- A Miniature MRI-compatible Fiber-optic Force Sensor Utilizing Fabry-Perot Interferometer -- Micromechanical Structure With Stable Linear Positive and Negative Stiffness -- Terahertz Metamaterial Structures Fabricated by PolyMUMPs -- Investigations Into 1D and 2D Metamaterials at Infrared Wavelengths -- MEMS Integrated Metamaterials With Variable Resonance Operating at RF Frequencies -- Creep Measurements in Free-standing Thin Metal Film Micro-cantilever Bending -- MEMS Reliability for Space Applications by Elimination of Potential Failure Modes Through Analysis -- Analysis and Evaluation Methods Associated With the Application of Compliant Thermal Interface Materials in Multi-chip Electronic Board Assemblies -- Hierarchical Reliability Model for Life Prediction of Actively Cooled LED-based Luminaire -- Direct Determination of Interfacial Traction-separation Relations in Chip-package Systems. |
520 ## - SUMMARY, ETC. |
Summary, etc |
MEMS and Nanotechnology represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference & Exposition on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Engineering. |
|
Topical term or geographic name as entry element |
Nanotechnology. |
|
Topical term or geographic name as entry element |
Engineering. |
|
Topical term or geographic name as entry element |
Nanotechnology and Microengineering. |
|
Topical term or geographic name as entry element |
Mechatronics. |
|
Topical term or geographic name as entry element |
Nanotechnology. |
710 2# - ADDED ENTRY--CORPORATE NAME |
Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY |
Title |
Springer eBooks |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Display text |
Printed edition: |
International Standard Book Number |
9781461402091 |
856 40 - ELECTRONIC LOCATION AND ACCESS |
Uniform Resource Identifier |
http://dx.doi.org/10.1007/978-1-4614-0210-7 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) |
Source of classification or shelving scheme |
|
Item type |
E-Book |