000 -LEADER |
fixed length control field |
04061nam a22004455i 4500 |
003 - CONTROL NUMBER IDENTIFIER |
control field |
OSt |
005 - DATE AND TIME OF LATEST TRANSACTION |
control field |
20140310143336.0 |
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
fixed length control field |
cr nn 008mamaa |
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
fixed length control field |
120215s2012 xxu| s |||| 0|eng d |
020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
International Standard Book Number |
9781461410539 |
|
978-1-4614-1053-9 |
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
Classification number |
621.317 |
Edition number |
23 |
264 #1 - |
-- |
New York, NY : |
-- |
Springer New York : |
-- |
Imprint: Springer, |
-- |
2012. |
912 ## - |
-- |
ZDB-2-ENG |
100 1# - MAIN ENTRY--PERSONAL NAME |
Personal name |
Liu, Yong. |
Relator term |
author. |
245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE |
Title |
Power Electronic Packaging |
Medium |
[electronic resource] : |
Remainder of title |
Design, Assembly Process, Reliability and Modeling / |
Statement of responsibility, etc |
by Yong Liu. |
300 ## - PHYSICAL DESCRIPTION |
Extent |
XVIII, 591p. 638 illus. |
Other physical details |
online resource. |
505 0# - FORMATTED CONTENTS NOTE |
Formatted contents note |
Challenges of Power Electronic Packaging -- Power Package Electrical Isolation Design -- Discrete Power MOSFET Package Design and Analysis -- Power IC Packaging Design and Analysis -- Power Module/SIP/3D/Stack/Embedded Packaging Design and Considerations -- Thermal Management, Design and Cooling for Power Electronics -- Material Characterization for Power Electronics Packaging -- Power Package Typical Assembly Process -- Power Packaging Typical Reliability and Tests -- Power Packaging Modeling and Challenges -- Power Package Thermal and Mechanical Co-Design Simulation Automation -- Power Package Electrical and Multiple Physics Simulation. . |
520 ## - SUMMARY, ETC. |
Summary, etc |
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. This book also: Explains numerous types of electronic packaging design, including power discrete packaging, power IC packaging and power wafer level CSP Provides the reader with a fundamental understanding of the evolution of power packaging, while also predicting future development trends in monolithic and hybrid integrations Presents the most advanced simulation and modeling methodologies in electronic packaging design, reliability, and assembly to insure that practitioners can fully test their power electronic packaging designs Power Electronic Packaging is an ideal book for engineers actively working in electronic packaging, assembly, material processing, reliability and failure, power electronics and devices. |
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
Topical term or geographic name as entry element |
Engineering. |
|
Topical term or geographic name as entry element |
Electronics. |
|
Topical term or geographic name as entry element |
Systems engineering. |
|
Topical term or geographic name as entry element |
Production of electric energy or power. |
|
Topical term or geographic name as entry element |
Engineering. |
|
Topical term or geographic name as entry element |
Power Electronics, Electrical Machines and Networks. |
|
Topical term or geographic name as entry element |
Electronics and Microelectronics, Instrumentation. |
|
Topical term or geographic name as entry element |
Solid State Physics. |
|
Topical term or geographic name as entry element |
Spectroscopy and Microscopy. |
|
Topical term or geographic name as entry element |
Circuits and Systems. |
710 2# - ADDED ENTRY--CORPORATE NAME |
Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
773 0# - HOST ITEM ENTRY |
Title |
Springer eBooks |
776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
Display text |
Printed edition: |
International Standard Book Number |
9781461410522 |
856 40 - ELECTRONIC LOCATION AND ACCESS |
Uniform Resource Identifier |
http://dx.doi.org/10.1007/978-1-4614-1053-9 |
942 ## - ADDED ENTRY ELEMENTS (KOHA) |
Source of classification or shelving scheme |
|
Item type |
E-Book |