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Designing TSVs for 3D Integrated Circuits (Record no. 10825)

000 -LEADER
fixed length control field 02901nam a22004455i 4500
003 - CONTROL NUMBER IDENTIFIER
control field OSt
005 - DATE AND TIME OF LATEST TRANSACTION
control field 20140310143339.0
007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION
fixed length control field cr nn 008mamaa
008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION
fixed length control field 120922s2013 xxu| s |||| 0|eng d
020 ## - INTERNATIONAL STANDARD BOOK NUMBER
International Standard Book Number 9781461455080
978-1-4614-5508-0
082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER
Classification number 621.3815
Edition number 23
264 #1 -
-- New York, NY :
-- Springer New York :
-- Imprint: Springer,
-- 2013.
912 ## -
-- ZDB-2-ENG
100 1# - MAIN ENTRY--PERSONAL NAME
Personal name Khan, Nauman.
Relator term author.
245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE
Title Designing TSVs for 3D Integrated Circuits
Medium [electronic resource] /
Statement of responsibility, etc by Nauman Khan, Soha Hassoun.
300 ## - PHYSICAL DESCRIPTION
Extent X, 76 p. 34 illus., 29 illus. in color.
Other physical details online resource.
440 1# - SERIES STATEMENT/ADDED ENTRY--TITLE
Title SpringerBriefs in Electrical and Computer Engineering,
International Standard Serial Number 2191-8112
505 0# - FORMATTED CONTENTS NOTE
Formatted contents note Introduction -- Background -- Analysis and Mitigation of TSV-Induced Substrate Noise -- TSVs for Power Delivery -- Early Estimation of TSV Area for Power Delivery in 3-D ICs -- Carbon Nanotubes for Advancing TSV Technology -- Conclusions and Future Directions.
520 ## - SUMMARY, ETC.
Summary, etc This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits.  It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. The book also investigates, in the form of a comparative study, the impact of TSV size and granularity, spacing of C4 connectors, off-chip power delivery network, shared and dedicated TSVs, and coaxial TSVs on the quality of power delivery in 3-D ICs. The authors provide detailed best design practices for designing 3-D power delivery networks.  Since TSVs occupy silicon real-estate and impact device density, this book provides four iterative algorithms to minimize the number of TSVs in a power delivery network. Unlike other existing methods, these algorithms can be applied in early design stages when only functional block- level behaviors and a floorplan are available. Finally, the authors explore the use of Carbon Nanotubes for power grid design as a futuristic alternative to Copper.
650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM
Topical term or geographic name as entry element Engineering.
Topical term or geographic name as entry element Computer science.
Topical term or geographic name as entry element Electronics.
Topical term or geographic name as entry element Systems engineering.
Topical term or geographic name as entry element Engineering.
Topical term or geographic name as entry element Circuits and Systems.
Topical term or geographic name as entry element Processor Architectures.
Topical term or geographic name as entry element Electronics and Microelectronics, Instrumentation.
700 1# - ADDED ENTRY--PERSONAL NAME
Personal name Hassoun, Soha.
Relator term author.
710 2# - ADDED ENTRY--CORPORATE NAME
Corporate name or jurisdiction name as entry element SpringerLink (Online service)
773 0# - HOST ITEM ENTRY
Title Springer eBooks
776 08 - ADDITIONAL PHYSICAL FORM ENTRY
Display text Printed edition:
International Standard Book Number 9781461455073
856 40 - ELECTRONIC LOCATION AND ACCESS
Uniform Resource Identifier http://dx.doi.org/10.1007/978-1-4614-5508-0
942 ## - ADDED ENTRY ELEMENTS (KOHA)
Source of classification or shelving scheme
Item type E-Book
Copies
Price effective from Permanent location Date last seen Not for loan Date acquired Source of classification or shelving scheme Koha item type Damaged status Lost status Withdrawn status Current location Full call number
2014-03-29AUM Main Library2014-03-29 2014-03-29 E-Book   AUM Main Library621.3815

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