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20140310153029.0 |
| 007 - PHYSICAL DESCRIPTION FIXED FIELD--GENERAL INFORMATION |
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111129s2012 xxu| s |||| 0|eng d |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9781461418122 |
|
978-1-4614-1812-2 |
| 050 #4 - LIBRARY OF CONGRESS CALL NUMBER |
|---|
| Classification number |
TK7800-8360 |
|
|---|
| Classification number |
TK7874-7874.9 |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.381 |
| Edition number |
23 |
| 264 #1 - |
|---|
| -- |
New York, NY : |
| -- |
Springer New York, |
| -- |
2012. |
| 912 ## - |
|---|
| -- |
ZDB-2-PHA |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
He, Ming. |
| Relator term |
author. |
| 245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE |
|---|
| Title |
Metal-Dielectric Interfaces in Gigascale Electronics |
| Medium |
[electronic resource] : |
| Remainder of title |
Thermal and Electrical Stability / |
| Statement of responsibility, etc |
by Ming He, Toh-Ming Lu. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
XI, 149p. 120 illus., 48 illus. in color. |
| Other physical details |
online resource. |
| 440 1# - SERIES STATEMENT/ADDED ENTRY--TITLE |
|---|
| Title |
Springer Series in Materials Science, |
| International Standard Serial Number |
0933-033X ; |
| Volume number/sequential designation |
157 |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Preface -- 1. Introduction -- 2. Metal-Dielectric Diffusion Processes: Fundamentals -- 3. Experimental Techniques -- 4. Al-Dielectric Interfaces -- 5. Cu-Dielectric Interfaces -- 6. Barrier Metal-Dielectric Interfaces -- 7. Self-Forming Barriers. 8. Kinetics of Ion Drift -- 9. Time-Dependent Dielectric Breakdown (TDDB) and Future Directions. |
| 520 ## - SUMMARY, ETC. |
|---|
| Summary, etc |
Metal-dielectric interfaces are ubiquitous in modern electronics. As advanced gigascale electronic devices continue to shrink, the stability of these interfaces is becoming an increasingly important issue that has a profound impact on the operational reliability of these devices. In this book, the authors present the basic science underlying the thermal and electrical stability of metal-dielectric interfaces and its relationship to the operation of advanced interconnect systems in gigascale electronics. Interface phenomena, including chemical reactions between metals and dielectrics, metallic-atom diffusion, and ion drift, are discussed based on fundamental physical and chemical principles. Schematic diagrams are provided throughout the book to illustrate interface phenomena and the principles that govern them. Metal-Dielectric Interfaces in Gigascale Electronics provides a unifying approach to the diverse and sometimes contradictory test results that are reported in the literature on metal-dielectric interfaces. The goal is to provide readers with a clear account of the relationship between interface science and its applications in interconnect structures. The material presented here will also be of interest to those engaged in field-effect transistor and memristor device research, as well as university researchers and industrial scientists working in the areas of electronic materials processing, semiconductor manufacturing, memory chips, and IC design. Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces Features fundamental considerations in the physics and chemistry of metal-dielectric interactions Explores mechanisms of metal atom diffusion and metal ion drift in dielectrics Provides keys to understanding reliability in gigascale electronics Focuses on a dynamic area of current research that is a foundation of future interconnect systems, memristors, and solid-state electrolyte devices Presents a unified approach to understanding the diverse phenomena observed at metal-dielectric interfaces |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Engineering. |
|
|---|
| Topical term or geographic name as entry element |
Chemistry. |
|
|---|
| Topical term or geographic name as entry element |
Electronics. |
|
|---|
| Topical term or geographic name as entry element |
Optical materials. |
|
|---|
| Topical term or geographic name as entry element |
Engineering. |
|
|---|
| Topical term or geographic name as entry element |
Electronics and Microelectronics, Instrumentation. |
|
|---|
| Topical term or geographic name as entry element |
Optical and Electronic Materials. |
|
|---|
| Topical term or geographic name as entry element |
Surface and Interface Science, Thin Films. |
|
|---|
| Topical term or geographic name as entry element |
Nanotechnology and Microengineering. |
|
|---|
| Topical term or geographic name as entry element |
Electrochemistry. |
|
|---|
| Topical term or geographic name as entry element |
Engineering Thermodynamics, Heat and Mass Transfer. |
| 700 1# - ADDED ENTRY--PERSONAL NAME |
|---|
| Personal name |
Lu, Toh-Ming. |
| Relator term |
author. |
| 710 2# - ADDED ENTRY--CORPORATE NAME |
|---|
| Corporate name or jurisdiction name as entry element |
SpringerLink (Online service) |
| 773 0# - HOST ITEM ENTRY |
|---|
| Title |
Springer eBooks |
| 776 08 - ADDITIONAL PHYSICAL FORM ENTRY |
|---|
| Display text |
Printed edition: |
| International Standard Book Number |
9781461418115 |
| 856 40 - ELECTRONIC LOCATION AND ACCESS |
|---|
| Uniform Resource Identifier |
http://dx.doi.org/10.1007/978-1-4614-1812-2 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
|
| Item type |
E-Book |
