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Advanced materials for thermal management of electronic packaging /

by Tong, Xingcun Colin.
Series: Springer series in advanced microelectronics ; . 30 1437-0387 ; Published by : Springer, (New York :) Physical details: xxi, 616 p. : ill. (some col.) ; 25 cm. ISBN: 1441977589 Subject(s): Electronic apparatus and appliances %Temperature control. | Electronic packaging %Materials. Year: 2011
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Item type Location Call Number Status Notes Date Due
Book Book AUM Main Library 621.381 T665 (Browse Shelf) Available JBC/2011/9269
Book Book AUM Main Library 621.381 T665 (Browse Shelf) Available JBC/2011/9269

Includes bibliographical references and index.

Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry.

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