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Electronic thin film reliability /

by Tu, K. N.
Published by : Cambridge University Press, (Cambridge :) Physical details: xvi, 396 p. : ill. ; 26 cm. ISBN: 0521516137 Subject(s): Thin films %Textbooks. | Reliability (Engineering) %Textbooks Year: 2011
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Item type Location Call Number Status Notes Date Due
Book Book AUM Main Library 621.38152 T823 (Browse Shelf) Available JBC/2012/1370
Book Book AUM Main Library 621.38152 T823 (Browse Shelf) Available JBC/2012/1370

Includes bibliographical references and index.

"Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners"--

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