Library of American University of Madaba Search for 'au:Tong, Xingcun Colin. and se:Springer series in advanced microelectronics and se:Springer series in advanced microelectronics '

Advanced materials for thermal management of electronic packaging /

By Tong, Xingcun Colin.. New York : Springer, 2011 . xxi, 616 p. : 25 cm.. 9781441977588 (hbk) | 1441977589 (hbk)

By Tong, Xingcun Colin.. . XXII, 618 p. 9781441977595