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Electroactivity in Polymeric Materials
by Rasmussen, Lenore.
Publication:
. IX, 161p. 91 illus.
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Lead Free Solder
by Pang, John Hock Lye.
Publication:
. X, 175p. 162 illus.
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Tuneable Film Bulk Acoustic Wave Resonators
by Gevorgian, Spartak Sh.
Publication:
. XVIII, 243 p. 107 illus., 38 illus. in color.
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Photophysics of Carbon Nanotubes Interfaced with Organic and Inorganic Materials
by Levitsky, Igor A.
Publication:
. VIII, 163 p. 58 illus.
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Electromagnetic Behaviour of Metallic Wire Structures
by Chui, S. T.
Publication:
. IX, 141 p. 42 illus., 21 illus. in color.
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Interfacial Compatibility in Microelectronics
by Laurila, Tomi.
Publication:
. X, 218 p.
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Tip-Based Nanofabrication
by Tseng, Ampere A.
Publication:
. X, 466p. 179 illus.
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Microelectronic Test Structures for CMOS Technology
by Bhushan, Manjul.
Publication:
. XXXIV, 374p. 303 illus.
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Advanced Materials for Thermal Management of Electronic Packaging
by Tong, Xingcun Colin.
Publication:
. XXII, 618 p.
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Advanced Flip Chip Packaging
by Tong, Ho-Ming.
Publication:
. VII, 560 p. 413 illus., 242 illus. in color.
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Reliability of Microtechnology
by Liu, Johan.
Publication:
. XIII, 204p. 50 illus.
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Moisture Sensitivity of Plastic Packages of IC Devices
by Fan, X.J.
Publication:
. XIV, 558p.
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Handbook of Transparent Conductors
by Ginley, David S.
Publication:
. XIV, 534p. 107 illus. in color.
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Dielectric Polymer Nanocomposites
by Nelson, J. Keith.
Publication:
. XX, 380p.
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Fundamentals of III-V Semiconductor MOSFETs
by Oktyabrsky, Serge.
Publication:
. XVI, 480p. 200 illus., 100 illus. in color.
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Cellular Nanoscale Sensory Wave Computing
by Baatar, Chagaan.
Publication:
. VIII, 249p.
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Three Dimensional Integrated Circuit Design
by Xie, Yuan.
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Metamaterials
by Cui, Tie Jun.
Publication:
. XXIV, 368p.
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Strain Effect in Semiconductors
by Sun, Yongke.
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
by Tan, Cher Ming.
Publication:
. VIII, 152 p.
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