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Designing a New Class of Distributed Systems
by Mikkilineni, Rao.
Publication:
. XII, 65p. 30 illus.
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High-Performance Computing Using FPGAs
by Vanderbauwhede, Wim.
Publication:
. XI, 803 p. 232 illus.
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Nanometer Variation-Tolerant SRAM
by Abu-Rahma, Mohamed H.
Publication:
. XVI, 170 p. 153 illus., 6 illus. in color.
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Adaptable Embedded Systems
by Beck, Antonio Carlos Schneider.
Publication:
. XIV, 311 p. 150 illus., 67 illus. in color.
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Parametric Analog Signal Amplification Applied to Nanoscale CMOS Technologies
by Oliveira, João P.
Publication:
. XXII, 186 p.
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Background Calibration of Time-Interleaved Data Converters
by El-Chammas, Manar.
Publication:
. XX, 124 p.
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Integrated Frequency Synthesis for Convergent Wireless Solutions
by Atallah, Jad G.
Publication:
. XV, 187 p. 114 illus., 2 illus. in color.
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System Specification and Design Languages
by Kaźmierski, Tom J.
Publication:
. XII, 256 p.
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Integrated Circuits for Analog Signal Processing
by Tlelo-Cuautle, Esteban.
Publication:
. X, 321 p. 240 illus.
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Analog-to-Digital Conversion
by Pelgrom, Marcel J.M.
Publication:
. XX, 546 p. 462 illus., 206 illus. in color.
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Embedded Systems Design with FPGAs
by Athanas, Peter.
Publication:
. X, 278 p. 147 illus., 50 illus. in color.
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System-Level Validation
by Chen, Mingsong.
Publication:
. XXI, 247 p. 103 illus., 6 illus. in color.
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Multi-Objective Optimization in Physical Synthesis of Integrated Circuits
by A. Papa, David.
Publication:
. IX, 155 p. 61 illus.
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Resource-Aware Data Fusion Algorithms for Wireless Sensor Networks
by Abdelgawad, Ahmed.
Publication:
. XV, 140p. 48 illus.
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Dynamic-Mismatch Mapping for Digitally-Assisted DACs
by Tang, Yongjian.
Publication:
. X, 164 p. 115 illus., 16 illus. in color.
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Partial Reconfiguration on FPGAs
by Koch, Dirk.
Publication:
. XV, 295 p. 158 illus.
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VLSI Design
by Chandrasetty, Vikram Arkalgud.
Publication:
. XIII, 106p. 93 illus.
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Wireless Communication Electronics
by Sobot, Robert.
Publication:
. XVIII, 386p. 263 illus., 123 illus. in color.
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Compact Models and Measurement Techniques for High-Speed Interconnects
by Sharma, Rohit.
Publication:
. XVIII, 69p. 29 illus., 6 illus. in color.
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Power Electronic Packaging
by Liu, Yong.
Publication:
. XVIII, 591p. 638 illus.
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