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Multiprocessor Systems on Chip
by Kempf, Torsten.
Publication:
. XVII, 189p. 80 illus.
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Advanced Materials for Thermal Management of Electronic Packaging
by Tong, Xingcun Colin.
Publication:
. XXII, 618 p.
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Dot-Dash to Dot.Com
by Wheen, Andrew.
Publication:
. XVIII, 302 p.
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Electronique Appliquée, Electromécanique sous Simscape & SimPowerSystems (Matlab/Simulink)
by Mokhtari, Mohand.
Publication:
. XIV, 664 p. 500 ill.
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Photo-Excited Charge Collection Spectroscopy
by Im, Seongil.
Publication:
. XI, 101 p. 61 illus.
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Powering Autonomous Sensors
by Penella-López, María Teresa.
Publication:
. XIII, 147p. 113 illus.
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Point-of-Care Diagnostics on a Chip
by Issadore, David.
Publication:
. XV, 226 p. 138 illus., 41 illus. in color.
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Graphene Nanoelectronics
by Raza, Hassan.
Publication:
. XXIII, 598p. 277 illus., 202 illus. in color.
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Factors Governing Tin Whisker Growth
by Crandall, Erika R.
Publication:
. XII, 136 p. 92 illus., 65 illus. in color.
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Three-phase AC-AC Power Converters Based on Matrix Converter Topology
by Szcześniak, Paweł.
Publication:
. XII, 174 p. 141 illus., 42 illus. in color.
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