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Advanced Flip Chip Packaging by Tong, Ho-Ming. Publication: . VII, 560 p. 413 illus., 242 illus. in color. Availability: Copies available: AUM Main Library (1),
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Nano-Bio- Electronic, Photonic and MEMS Packaging by Wong, C.P. Publication: . XI, 761p. Availability: Copies available: AUM Main Library (1),
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