|
|
Heteromagnetic microelectronics : , microsystems of active type /
by Ignatiev, Alexander A.
Publication:
New York : Springer, 2010
. xxiv, 506 p. :
25 cm.
Date:2010
Availability:
Copies available:
AUM Main Library
(2),
|
|
|
Sensors and Microsystems
by Neri, Giovanni.
Publication:
. XX, 496 p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Multiobjective Shape Design in Electricity and Magnetism
by Di Barba, Paolo.
Publication:
. XVII, 313p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Deterministic Solvers for the Boltzmann Transport Equation
by Hong, Sung-Min.
Publication:
. XVIII, 227 p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
High Permittivity Gate Dielectric Materials
by Kar, Samares.
Publication:
. XXXII, 489 p. 325 illus., 168 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Springer Handbook of Nanotechnology
by Bhushan, Bharat.
Publication:
. XLVIII, 1964p. 1577 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Piezoresistor Design and Applications
by Doll, Joseph C.
Publication:
. XI, 245 p. 101 illus., 86 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Fundamentals of Nanoscaled Field Effect Transistors
by Chaudhry, Amit.
Publication:
. XIV, 201 p. 121 illus., 102 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Sensors
by Kalantar-zadeh, Kourosh.
Publication:
. XII, 196 p. 141 illus., 47 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Solid State Lighting Reliability
by van Driel, W.D.
Publication:
. X, 617 p. 420 illus., 23 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Lead Free Solder
by Pang, John Hock Lye.
Publication:
. X, 175p. 162 illus.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Lead-Free Piezoelectrics
by Priya, Shashank.
Publication:
. VIII, 528 p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Microelectronic Test Structures for CMOS Technology
by Bhushan, Manjul.
Publication:
. XXXIV, 374p. 303 illus.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Advanced Materials for Thermal Management of Electronic Packaging
by Tong, Xingcun Colin.
Publication:
. XXII, 618 p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Machining with Abrasives
by Jackson, Mark J.
Publication:
. XIV, 423p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Advanced Flip Chip Packaging
by Tong, Ho-Ming.
Publication:
. VII, 560 p. 413 illus., 242 illus. in color.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Reliability of Microtechnology
by Liu, Johan.
Publication:
. XIII, 204p. 50 illus.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Moisture Sensitivity of Plastic Packages of IC Devices
by Fan, X.J.
Publication:
. XIV, 558p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Cellular Nanoscale Sensory Wave Computing
by Baatar, Chagaan.
Publication:
. VIII, 249p.
Availability:
Copies available:
AUM Main Library
(1),
|
|
|
Three Dimensional Integrated Circuit Design
by Xie, Yuan.
Publication:
Availability:
Copies available:
AUM Main Library
(1),
|
|