| 000 -LEADER |
|---|
| fixed length control field |
01763cam a22002415a 4500 |
| 005 - DATE AND TIME OF LATEST TRANSACTION |
|---|
| control field |
20190504130748.0 |
| 008 - FIXED-LENGTH DATA ELEMENTS--GENERAL INFORMATION |
|---|
| fixed length control field |
110613s2011 nyua b 001 0 eng |
| 020 ## - INTERNATIONAL STANDARD BOOK NUMBER |
|---|
| International Standard Book Number |
9781441977588 (hbk) |
|
|---|
| International Standard Book Number |
1441977589 (hbk) |
| 041 ## - Language |
|---|
| Language code of text/sound track or separate title |
eng |
| 082 04 - DEWEY DECIMAL CLASSIFICATION NUMBER |
|---|
| Classification number |
621.381 |
| Edition number |
22 |
| Item number |
T665 |
| 100 1# - MAIN ENTRY--PERSONAL NAME |
|---|
| Personal name |
Tong, Xingcun Colin. |
| 9 (RLIN) |
11391 |
| 245 10 - IMMEDIATE SOURCE OF ACQUISITION NOTE |
|---|
| Title |
Advanced materials for thermal management of electronic packaging / |
| Statement of responsibility, etc |
Xingcun Colin Tong. |
| 260 ## - PUBLICATION, DISTRIBUTION, ETC. (IMPRINT) |
|---|
| Place of publication, distribution, etc |
New York : |
| Name of publisher, distributor, etc |
Springer, |
| Date of publication, distribution, etc |
2011. |
| 300 ## - PHYSICAL DESCRIPTION |
|---|
| Extent |
xxi, 616 p. : |
| Other physical details |
ill. (some col.) ; |
| Dimensions |
25 cm. |
| 440 ## - SERIES STATEMENT/ADDED ENTRY--TITLE |
|---|
| Title |
Springer series in advanced microelectronics ; |
| Volume number/sequential designation |
30 |
| International Standard Serial Number |
1437-0387 ; |
| 9 (RLIN) |
11394 |
| 504 ## - BIBLIOGRAPHY, ETC. NOTE |
|---|
| Bibliography, etc |
Includes bibliographical references and index. |
| 505 0# - FORMATTED CONTENTS NOTE |
|---|
| Formatted contents note |
Thermal management fundamentals and design guides in electronic packaging -- Characterization methodologies of thermal management materials -- Electronic packaging materials and their functions in thermal managements -- Monolithic carbonaceous materials and carbon matrix composites -- Thermally conductive polymer matrix composites -- HIgh thermal conductivity metal matrix composites -- Thermally conductive ceramic matrix composites -- Thermal interface materials in electronic packaging -- Materials and design for advanced heat spreader and air cooling heat sinks -- Liquid cooling devices and their materials selection -- Thermoelectric cooling through thermoelectric materials -- Development and application of advanced thermal management materials -- Standards and specifications for evaluation of thermal management in electronic industry. |
| 650 #0 - SUBJECT ADDED ENTRY--TOPICAL TERM |
|---|
| Topical term or geographic name as entry element |
Electronic apparatus and appliances |
| General subdivision |
Temperature control. |
| 9 (RLIN) |
11392 |
|
|---|
| Topical term or geographic name as entry element |
Electronic packaging |
| General subdivision |
Materials. |
| 9 (RLIN) |
11393 |
| 830 #0 - SERIES ADDED ENTRY--UNIFORM TITLE |
|---|
| Uniform title |
Springer series in advanced microelectronics ; |
| Volume number/sequential designation |
30. |
| 9 (RLIN) |
11394 |
| 942 ## - ADDED ENTRY ELEMENTS (KOHA) |
|---|
| Source of classification or shelving scheme |
|
| Item type |
Book |
