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Advanced materials for thermal management of electronic packaging /
by Tong, Xingcun Colin.
Publication:
New York : Springer, 2011
. xxi, 616 p. :
25 cm.
Date:2011
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(2),
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High Mobility and Quantum Well Transistors
by Hellings, Geert.
Publication:
. XVIII, 140 p. 77 illus.
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(1),
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Variation-Aware Adaptive Voltage Scaling for Digital CMOS Circuits
by Wirnshofer, Martin.
Publication:
. XI, 83 p. 53 illus.
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Inside Solid State Drives (SSDs)
by Micheloni, Rino.
Publication:
. XVIII, 381 p. 280 illus.
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Load-Pull Techniques with Applications to Power Amplifier Design
by Ghannouchi, Fadhel M.
Publication:
. XIV, 234 p. 181 illus.
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(1),
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Electromagnetic Vibration Energy Harvesting Devices
by Spreemann, Dirk.
Publication:
. XVII, 196p. 172 illus.
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Adiabatic Logic
by Teichmann, Philip.
Publication:
. XVIII, 166 p.
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Electronic Devices for Analog Signal Processing
by Rybin, Yu. K.
Publication:
. XII, 260 p.
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(1),
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Time-to-Digital Converters
by Henzler, Stephan.
Publication:
. XII, 124p.
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Variation Aware Analog and Mixed-Signal Circuit Design in Emerging Multi-Gate CMOS Technologies
by Fulde, Michael.
Publication:
. X, 127p.
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High Permittivity Gate Dielectric Materials
by Kar, Samares.
Publication:
. XXXII, 489 p. 325 illus., 168 illus. in color.
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Delta-Sigma A/D-Converters
by Gaggl, Richard.
Publication:
. XVIII, 145 p. 88 illus., 47 illus. in color.
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High-Performance D/A-Converters
by Clara, Martin.
Publication:
. XXII, 283 p. 201 illus., 32 illus. in color.
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Low Power and Reliable SRAM Memory Cell and Array Design
by Ishibashi, Koichiro.
Publication:
. XII, 144 p.
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(1),
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Lock-in Thermography
by Breitenstein, Otwin.
Publication:
. X, 258 p.
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Advanced Materials for Thermal Management of Electronic Packaging
by Tong, Xingcun Colin.
Publication:
. XXII, 618 p.
Availability:
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