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Moisture Sensitivity of Plastic Packages of IC Devices
by Fan, X.J.
Publication:
. XIV, 558p.
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Handbook of Transparent Conductors
by Ginley, David S.
Publication:
. XIV, 534p. 107 illus. in color.
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Dielectric Polymer Nanocomposites
by Nelson, J. Keith.
Publication:
. XX, 380p.
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Fundamentals of III-V Semiconductor MOSFETs
by Oktyabrsky, Serge.
Publication:
. XVI, 480p. 200 illus., 100 illus. in color.
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Cellular Nanoscale Sensory Wave Computing
by Baatar, Chagaan.
Publication:
. VIII, 249p.
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RF and Microwave Microelectronics Packaging
by Kuang, Ken.
Publication:
. XVI, 285 p.
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Introduction to THz Wave Photonics
by Zhang, Xi-Cheng.
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Three Dimensional Integrated Circuit Design
by Xie, Yuan.
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Metamaterials
by Cui, Tie Jun.
Publication:
. XXIV, 368p.
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Strain Effect in Semiconductors
by Sun, Yongke.
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
by Tan, Cher Ming.
Publication:
. VIII, 152 p.
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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
by Grossmann, Günter.
Publication:
. VIII, 313 p. 202 illus., 22 illus. in color.
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Electrical Conductive Adhesives with Nanotechnologies
by Li, Yi.
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Non-linear Continuum Theories
by Grioli, G.
Publication:
. 358p.
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Computer Vision and Action Recognition
by Ahad, Md. Atiqur Rahman.
Publication:
. XXII, 214 p.
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Web Data Mining
by Liu, Bing.
Publication:
. XX, 624 p.
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Biomedical Engineering Systems and Technologies
by Fred, Ana.
Publication:
. Approx. 420 p.
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Precision Assembly Technologies and Systems
by Ratchev, Svetan.
Publication:
. XIII, 344p. 234 illus.
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Optical Signal Processing by Silicon Photonics
by Ahmed, Jameel.
Publication:
. XI, 126 p. 60 illus., 24 illus. in color.
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Plasmonics: Theory and Applications
by Shahbazyan, Tigran V.
Publication:
. XV, 577 p. 244 illus., 208 illus. in color.
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