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RF and Microwave Microelectronics Packaging by Kuang, Ken. Publication: . XVI, 285 p. Availability: Copies available: AUM Main Library (1),
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Advanced Thermal Management Materials by Jiang, Guosheng. Publication: . VIII, 156 p. 72 illus., 29 illus. in color. Availability: Copies available: AUM Main Library (1),
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