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Advanced Materials for Thermal Management of Electronic Packaging
by Tong, Xingcun Colin.
Publication:
. XXII, 618 p.
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Wave Propagation and Radiation in Gyrotropic and Anisotropic Media
by Eroglu, Abdullah.
Publication:
. XIII, 222p.
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Advanced Flip Chip Packaging
by Tong, Ho-Ming.
Publication:
. VII, 560 p. 413 illus., 242 illus. in color.
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Reliability of Microtechnology
by Liu, Johan.
Publication:
. XIII, 204p. 50 illus.
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Moisture Sensitivity of Plastic Packages of IC Devices
by Fan, X.J.
Publication:
. XIV, 558p.
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Handbook of Transparent Conductors
by Ginley, David S.
Publication:
. XIV, 534p. 107 illus. in color.
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Dielectric Polymer Nanocomposites
by Nelson, J. Keith.
Publication:
. XX, 380p.
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Fundamentals of III-V Semiconductor MOSFETs
by Oktyabrsky, Serge.
Publication:
. XVI, 480p. 200 illus., 100 illus. in color.
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Cellular Nanoscale Sensory Wave Computing
by Baatar, Chagaan.
Publication:
. VIII, 249p.
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RF and Microwave Microelectronics Packaging
by Kuang, Ken.
Publication:
. XVI, 285 p.
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Introduction to THz Wave Photonics
by Zhang, Xi-Cheng.
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Three Dimensional Integrated Circuit Design
by Xie, Yuan.
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Metamaterials
by Cui, Tie Jun.
Publication:
. XXIV, 368p.
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Strain Effect in Semiconductors
by Sun, Yongke.
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
by Tan, Cher Ming.
Publication:
. VIII, 152 p.
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The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects
by Grossmann, Günter.
Publication:
. VIII, 313 p. 202 illus., 22 illus. in color.
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Electrical Conductive Adhesives with Nanotechnologies
by Li, Yi.
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Neural Information Processing
by Huang, Tingwen.
Publication:
. XXII, 710 p. 305 illus.
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Computer Vision – ECCV 2012. Workshops and Demonstrations
by Fusiello, Andrea.
Publication:
. XXII, 611 p. 323 illus.
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Pattern Recognition
by Goesele, Michael.
Publication:
. XXI, 574p. 262 illus.
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