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Robotic Tactile Sensing
by Dahiya, Ravinder S.
Publication:
. XX, 245 p. 108 illus.
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ECODESIGN -- The Competitive Advantage
by Wimmer, Wolfgang.
Publication:
. XX, 228 p.
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Electronic Engineering and Computing Technology
by Ao, Sio-Iong.
Publication:
. XII, 500p.
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Smart Sensors for Real-Time Water Quality Monitoring
by Mukhopadhyay, Subhas C.
Publication:
. X, 285 p. 123 illus.
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Low Power RF Circuit Design in Standard CMOS Technology
by Alvarado, Unai.
Publication:
. XX, 236 p.
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Advanced Microsystems for Automotive Applications 2010
by Meyer, Gereon.
Publication:
. XVIII, 466p. 150 illus. in color.
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Ultra Low Power Transceiver for Wireless Body Area Networks
by Masuch, Jens.
Publication:
. VIII, 122 p. 94 illus., 34 illus. in color.
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Designing TSVs for 3D Integrated Circuits
by Khan, Nauman.
Publication:
. X, 76 p. 34 illus., 29 illus. in color.
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Current Feedback Operational Amplifiers and Their Applications
by Senani, Raj.
Publication:
. XVII, 249 p. 219 illus.
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Cognitive Radio Networks
by Khattab, Ahmed.
Publication:
. XXII, 110 p. 34 illus., 31 illus. in color.
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Fault-Tolerant Design
by Dubrova, Elena.
Publication:
. XV, 185 p. 84 illus.
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Analog-to-Digital Conversion
by Pelgrom, Marcel J.M.
Publication:
. XX, 546 p. 462 illus., 206 illus. in color.
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VLSI for Wireless Communication
by Leung, Bosco.
Publication:
. XXVI, 546 p.
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Transient and Permanent Error Control for Networks-on-Chip
by Yu, Qiaoyan.
Publication:
. XII, 160 p.
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Next Generation Microchannel Heat Exchangers
by Ohadi, Michael.
Publication:
. XII, 116 p. 101 illus., 13 illus. in color.
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Introduction to Open Core Protocol
by Schwaderer, W David.
Publication:
. XV, 165 p. 57 illus.
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Life-Cycle Assessment of Semiconductors
by Boyd, Sarah B.
Publication:
. XXVII, 226p. 50 illus.
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Electrical Conductive Adhesives with Nanotechnologies
by Li, Yi.
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MEMS Materials and Processes Handbook
by Ghodssi, Reza.
Publication:
. XXXVI, 1188 p. 200 illus.
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The Essential PIC18® Microcontroller
by Katzen, Sid.
Publication:
. XII, 612p.
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