Keynote Presentation (40 minutes) -- Residual Stresses Measurement and Inner Geometry Inspection of Pipelines by Optical Methods -- Contour Method Advanced Applications: Hoop Stresses in Cylinders and Discontinuities -- Measurement of Bulk Residual Stress Distributions in Thick-section Components Using the Contour Method -- Application of a Finite Strain Elastic-plastic Self-consistent Model to Deformation of Magnesium -- Probing Strained Semiconductor Structures With Nanoscale X-ray Diffraction -- Residual Stress State in Tools Used for Thermo-mechanical Metal Forming Processes -- Determining Residual Stress and Young’s Modulus – Can Digital Shearography Assist -- Ultrasonic Technique and Equipment for Residual Stresses Measurement -- Benchmark Measurement of Residual Stresses in a 7449 Aluminium Alloy Using Deep‐hole and Incremental Centre‐hole Drilling Methods -- A New Procedure for Measuring Residual Stresses in Electron Beam Welds Using the Deep Hole Drilling Technique -- The Incremental Core Drilling Method to Determine In-situ Stresses in Concrete -- Influence of Drilling Parameters on the Accuracy of Hole-drilling Residual Stress Measurements -- Study of Frequency Parameter of Stiffened Plates -- Residual Stress on Ti6Al4V Hybrid and Laser Welded Joints -- Residual Stress Management: Measurement, Fatigue Analysis and Beneficial Redistribution -- Assessment of Effective Prestress Force of PCCV Using SI Technique.

Engineering Applications of Residual Stress represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference & Exposition on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011.� The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials, MEMS and Nanotechnology; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.