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Item type | Location | Call Number | Status | Notes | Date Due |
---|---|---|---|---|---|
Book | AUM Main Library | 621.38152 T823 (Browse Shelf) | Available | JBC/2012/1370 | |
Book | AUM Main Library | 621.38152 T823 (Browse Shelf) | Available | JBC/2012/1370 |
621.38152 D553Dilute III-V nitride semiconductors and material systems : | 621.38152 S531Advance semiconductor devices / | 621.38152 T823Electronic thin film reliability / | 621.38152 T823Electronic thin film reliability / | 621.3815284 M275Strained-Si heterostructure field effect devices / | 621.3815284 M275Strained-Si heterostructure field effect devices / |
Includes bibliographical references and index.
"Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners"--
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