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MEMS Reliability
by Hartzell, Allyson L.
Publication:
. XIII, 291 p.
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Advanced Power MOSFET Concepts
by Baliga, B. Jayant.
Publication:
. XV, 534p.
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Feedback Control of MEMS to Atoms
by Gorman, Jason J.
Publication:
. VIII, 384 p.
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Advanced Flip Chip Packaging
by Tong, Ho-Ming.
Publication:
. VII, 560 p. 413 illus., 242 illus. in color.
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Reliability of Microtechnology
by Liu, Johan.
Publication:
. XIII, 204p. 50 illus.
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Moisture Sensitivity of Plastic Packages of IC Devices
by Fan, X.J.
Publication:
. XIV, 558p.
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Remote Instrumentation and Virtual Laboratories
by Davoli, Franco.
Publication:
. XXVI, 519p.
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Microfluidics and Microfabrication
by Chakraborty, Suman.
Publication:
. XVI, 357 p.
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Cellular Nanoscale Sensory Wave Computing
by Baatar, Chagaan.
Publication:
. VIII, 249p.
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RF and Microwave Microelectronics Packaging
by Kuang, Ken.
Publication:
. XVI, 285 p.
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Three Dimensional Integrated Circuit Design
by Xie, Yuan.
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Quantifying and Exploring the Gap Between FPGAs and ASICs
by Kuon, Ian.
Publication:
. XII, 181p.
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Strain Effect in Semiconductors
by Sun, Yongke.
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Piezoelectric-Based Vibration Control
by Jalili, Nader.
Publication:
. XV, 517p. 293 illus.
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Vector Control of Induction Machines
by Robyns, Benoît.
Publication:
. XXVI, 222p. 152 illus., 14 illus. in color.
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Digital Signal Processing in Power System Protection and Control
by Rebizant, Waldemar.
Publication:
. XVI, 316 p.
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Assessment of Power System Reliability
by Čepin, Marko.
Publication:
. XXI, 300p. 105 illus., 13 illus. in color.
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Vulnerable Systems
by Kröger, Wolfgang.
Publication:
. XIV, 204p. 63 illus., 6 illus. in color.
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Applications of Finite Element Methods for Reliability Studies on ULSI Interconnections
by Tan, Cher Ming.
Publication:
. VIII, 152 p.
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Advanced Methods of Solid Oxide Fuel Cell Modeling
by Milewski, Jarosław.
Publication:
. XIV, 218 p.
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