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Architecture of Brazil
by Segawa, Hugo.
Publication:
. XIII, 266 p. 144 illus.
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Bio/CMOS Interfaces and Co-Design
by Carrara, Sandro.
Publication:
. XIV, 258 p. 216 illus., 109 illus. in color.
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Topics on the Dynamics of Civil Structures, Volume 1
by Caicedo, J.M.
Publication:
. IX, 449 p. 422 illus.
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Nanometer Variation-Tolerant SRAM
by Abu-Rahma, Mohamed H.
Publication:
. XVI, 170 p. 153 illus., 6 illus. in color.
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Adaptable Embedded Systems
by Beck, Antonio Carlos Schneider.
Publication:
. XIV, 311 p. 150 illus., 67 illus. in color.
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Compact Models and Measurement Techniques for High-Speed Interconnects
by Sharma, Rohit.
Publication:
. XVIII, 69p. 29 illus., 6 illus. in color.
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Low Power Design with High-Level Power Estimation and Power-Aware Synthesis
by Ahuja, Sumit.
Publication:
. XXII, 170p. 39 illus.
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High Performance Marine Vessels
by Yun, Liang.
Publication:
. XXII, 359p. 284 illus.
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Reliability, Availability and Serviceability of Networks-on-Chip
by Cota, Érika.
Publication:
. XIII, 209p. 103 illus.
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Statistical Performance Analysis and Modeling Techniques for Nanometer VLSI Designs
by Shen, Ruijing.
Publication:
. XXXI, 305p. 104 illus.
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SystemVerilog for Verification
by Spear, Chris.
Publication:
. XLIII, 464 p. 720 illus.
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3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
by Li, Simon.
Publication:
. XIV, 292p. 233 illus., 228 illus. in color.
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Understanding and Using the Controller Area Network Communication Protocol
by Di Natale, Marco.
Publication:
. XVIII, 226 p.
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Ultra High-Speed CMOS Circuits
by Gharavi, Sam.
Publication:
. VII, 106 p. 91 illus.
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Heterogeneous Multicore Processor Technologies for Embedded Systems
by Uchiyama, Kunio.
Publication:
. XI, 224p. 192 illus.
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Engineering Applications of Residual Stress, Volume 8
by Proulx, Tom.
Publication:
. VIII, 140 p.
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Reconfigurable Computing
by Cardoso, João M. P.
Publication:
. XV, 296p. 107 illus.
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Nanometer CMOS Sigma-Delta Modulators for Software Defined Radio
by Morgado, Alonso.
Publication:
. XVIII, 288p. 226 illus.
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Semantic Modeling and Interoperability in Product and Process Engineering
by Ma, Yongsheng.
Publication:
. XVIII, 389 p. 200 illus., 63 illus. in color.
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The Contribution of Technology to Added Value
by Fernandes, António S.C.
Publication:
. VIII, 104 p. 29 illus.
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